Steven M. Bowers received his B.S. in Electrical Engineering from the University of California, San Diego and his M.S. and Ph.D. in mm-wave circuits and systems from the California Institute of Technology. Subsequently, he completed postdoctoral fellow at Caltech. He is currently an Associate Professors of Electrical Engineering at University of Virginia. His research interests include holistic integration of high-frequency analog circuits, advanced digital circuits, novel electromagnetic structures and integrated silicon photonics to enable the next generation of mm-wave applications, specifically in adaptive and self-healing mm-wave circuits and mm-wave power generation and radiation. He received the Caltech Institute Fellowship in 2007, Analog Devices Outstanding Student Designer Award in 2009, is a member of IEEE, HKN and TBP, and was the recipient of the IEEE RFIC Symposium Best Student Paper award in 2012 and the IEEE IMS Best Student Paper award in 2013.
Pouyan Bassirian received his B.S. degree in electrical engineering from the University Tehran, Iran, in 2015. He joined IECS at University of Virginia in 2015 to pursue his Ph.D. degree in electrical engineering. His areas of research interest include mm-wave electronics, holistic integration of high frequency circuits and electromagnetic structures, microwave and antenna theory and their applications in various disciplines.
Vinay Iyer received the B.S. degree in electrical engineering from the Birla Institute of Technology and Science Pilani, Goa, India, in 2012, the M.S. degree in electrical engineering from North Carolina State University, Raleigh, NC, USA, in 2014, and the Ph.D. degree in electrical engineering from the University of Virginia, Charlottesville, VA, USA, in 2023. He recently joined Nokia Corporation, where he works on integrated transceiver design for coherent optical communications. His research interests include the design of millimeter-wave and terahertz circuit design, including high-efficiency InP HBT power amplifiers and multipliers, and multifunctional integration across substrates.
